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  • Concept Product CP137 (MB998V4P-B)
    Concept Product CP137 (MB998V4P-B)
    Concept Product CP137 (MB998V4P-B)
    Product FeaturesView All

    •Accommodates 8x U.2/U.3 PCIe NVMe SSDs, supporting a maximum drive height of 7mm.
    •Fits any standard external 5.25" optical drive bay.
    •Utilizes 4x MCIO 8i (SFF-TA-1016 8i) connectors for 8x U.2/U.3 SSDs.
    •Delivers PCIe 5.0 speeds with transfer rates up to 128Gb/s per drive bay.
    •Compatible with Tri-mode controllers PCIe/NVMe pinout (Broadcom, Areca, and more).
    •Rugged full-metal enclosure meeting flammability standards.
    •Removable tray system for simplified maintenance.

  • Concept Product CP134 (MB307U-1VB)
    Concept Product CP134 (MB307U-1VB)
    Concept Product CP134 (MB307U-1VB)
    Product FeaturesView All

    •Supports a single U.2/U.3 PCIe NVMe SSD
    •10,000+ rated insertion and removal cycle connector
    •Blazing-fast 40Gb/s transfers via USB4 and Thunderbolt 4
    •Backward compatible with USB 3.0, USB 2.0, and Thunderbolt 3
    •Tool-less SSD installation design with or without a drive tray
    •Vibrant blue activity LED
    •User-friendly, large slide-switch power control

  • Concept Product CP169
    Concept Product CP169
    Concept Product CP169
    Product FeaturesView All

    • Ultra-compact, non-standard module size tailored for OEM and rackmount system integration
    • Supports 8 × 7.5mm E3.S NVMe SSDs
    • PCIe 5.0 x4 bandwidth up to 128Gbps per SSD (depending on SSD performance)
    • 4 × MCIO 8i (SFF-TA-1016) host interfaces
    • Front-access removable E3.S SSD tray design
    • Supports hot-plug drive replacement

  • Concept Product CP167
    Concept Product CP167
    Concept Product CP167
    Product FeaturesView All

    • Supports 8 × 9.5mm E1.S NVMe SSDs
    • Fits one standard 5.25” drive bay
    • PCIe 5.0 x4 bandwidth up to 128Gbps per SSD (depending on SSD performance)
    • 4 × MCIO 8i (SFF-TA-1016) host interfaces
    • Removable E1.S SSD tray design for easier maintenance and serviceability
    • Liquid-cooling architecture for high-efficiency thermal management

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